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Power Electronics > Heat Sinks, Heatpipes & Busbars > Air Cooling for Disc Semiconductors

Air Cooling for Disc Semiconductors

 

 

 

 

 

 

Air Cooling Heat Sinks - Hockey Puck Cooler SKL-SF
The series SKL is designed specifically for air cooling applications of stacked or individual high power disc-shaped semiconductors.  The thick, columnar fins permit high clamping forces necessary in stacked applications, and the serrated fin features enhance the surface area for optiimal cooling performance.

Additionally the fins are attached to the baseplate with patent pending cold weld process that ensures the lowest thermal interface resistance.

 

DAU

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SUPPORT DOCUMENTS

  • Hocky Puck Cooler SKL
  • Hockey Puck Cooler SKL Thermal Data
  • Hockey Puck Cooler SKL-SF
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