| The Insulated Gate Bipolar Transistor (IGBT) is the youngest member of the high voltage switch family. Current flow through the device is conveniently controlled through a 15V high-impedance voltage source, thus enabling control of high currents with very low control power.
LoPak IGBT Modules - click here for further information & downloading datasheets.
The LoPak IGBT module is an innovative, low profile, low inductance packaging concept for 3-phase IGBT bridges. Available in two housing sizes, designated LoPak4 and LoPak5, these devices are available without copper base-plates for enhanced power-cycling capability. The silicon chips are mounted on a DCB substrate (Direct Copper Bonding) the opposite side of which is pressed directly to the heatsink, thus eliminating all delamination problems resulting from power cycling and shortening the thermal path to the sink. A further innovation of the LoPak lies in the "clip-on" gate-unit connection feature. This allows the gate-unit to be snapped in place as the last stage of inverter manufacturing, thereby eliminating soldering from the assembly line processes.
The present LoPak family covers the range of 150 to 300 A at 1200 and 1700V.
HiPak™ modules with SPT Chips - click here for further information & downloading datasheets.
The HiPak™ modules are high power IGBTs in industry standard housings with the popular 190 x 140 mm footprint. The initial ABB offering is for devices using Aluminium Silicon Carbide (AlSiC) base-plate material for excellent thermal cycling capability as required in traction applications and Aluminium Nitride (AlN) isolation for low thermal resistance.
These products are available as single-switch configuration (IGBT +FW Diode).
HiPak™ modules are realised with ABB's advanced Soft Punch Through (SPT) chip technology which combines low losses with soft switching performance and rugged Safe Operating Area (SOA).
StakPak™ IGBT Press-Packs - click here to open new window with part numbers & datasheets.
StakPak™ is a family of high power IGBT press-packs and diodes in an advanced modular housing which guarantees uniform chip pressure even in multiple-device stacks.
Although the most common package for IGBTs is the isolated module, for applications requiring series connection, non-isolated, pressure-assembled devices (press-packs) are preferred for many reasons, not least of which is their ability to fail short as opposed to open circuit. Since IGBTs are made with multiple parallel chips, there is a difficulty - with conventional press-packs - in assuring uniform pressure on all chips; a difficulty which increases with the number of devices in a stack. ABB has solved these problems with a patented spring technology.
The StakPak™, optimised for series connection, features a modular concept based on "sub-modules" allowing the cost-effective realisation of a range of products of different current ratings and IGBT/diode ratios.
The initial ABB StakPak™ offering is shown below. Higher voltages, and asymmetric devices are in development.
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